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Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
*Customer :
SPECIFICATION
ITEM MODEL PART NO. TOP LED DEVICE SSC-KWT824 Rev 0.0
[Contents]
1. Features -------------------------------------------------------------------------- 2 2. Absolute Maximum Ratings ------------------------------------------------- 2 3. Electro-optical Characteristics ----------------------------------------------- 2 4. CIE Chromaticity Diagram ------------------------------------------------- 3 5. Characteristic Diagram -------------------------------------------------------- 4 6. Soldering Profile --------------------------------------------------------------- 5 7. Outline Dimensions And Materials -------------------------------------- 6 8. Reel Dimensions --------------------------------------------------------------- 7 9. Reel Packing Structure ------------------------------------------------------ 8 10. Lot Number --------------------------------------------------------------------- 9 11. Precaution for Use ------------------------------------------------------------ 10
12. Reliability- -------------------------------------------------------------- 11 CUSTOMER Checked by Approved by
SUPPLIER Drawn by Checked by Approved by
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
1.Features
White colored SMT package Suitable for all SMT assembly methods ; Suitable for all soldering methods Applications : * Mobile Handset * Illumination
2. Absolute Maximum Ratings*1
Parameter Power Dissipation Forward Current Peak Forward Current (per die) Reverse Voltage (per die) LED Junction Temperature Operating Temperature Storage Temperature Symbol Pd IF IFM VR Tj Topr Tstg
*2
(Ta=25C) Value 333 90 100 5 125 -30 ~ +85 -40 ~ +100 Unit mW mA mA V C C C
*1 Care is to be taken that Power Dissipation does not exceed the Absolute Maximum Rating of the product. *2 IFM conditions is Pulse width Tw 0.1ms, Duty ratio 1/10.
3. Electro-Optical Characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminous Intensity*1 Peak Luminous Intensity vs. Drive Current (Flash Mode) *2 Viewing Angle *3 Chromaticity Coordinates 2 1/2 x y Symbol VF IR IV Condition IF = 20mA VR = 5V IF = 60mA IF = 90mA IF =170mA IF = 60 mA IF = 60 mA IF = 60 mA Min Typ 3.2 4 5.5 12 120 0.31 0.31
(Ta=25C) Max 50 Unit V A cd cd cd deg. -
*1 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10%. *2 Flash mode condition is Pulse width Tw = 1sec, Duty ratio = 2 / 5 *3 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Note : All measurements were made under the standardized environment of SSC
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
4. CIE Chromaticity Diagram
ICI Chromaticity Diagram
0.9 0.8 0.7 0.6 0.5
Y
0.4
d
0.3
a
b c
0.2 0.1 0.0 0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
X
BIN A B C D x y x y x y x y 0.271 0.284 0.283 0.305 0.287 0.295 0.330 0.360
0.01
Chromaticity Coordinates 0.285 0.259 0.287 0.295 0.296 0.276 0.330 0.318 0.296 0.276 0.330 0.339 0.330 0.318 0.344 0.335 0.283 0.305 0.330 0.360 0.330 0.339 0.346 0.374
*Color Coordinates Measurement allowance is
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
5. Characteristic Diagram
Forward Voltage vs. Forward Current (per die)
3.4
Forward Current vs. Relative Intensity
140 120
3.2
Forward Voltage VF [V]
100
Relative intensity[%]
80 60 40 20 0
3.0
2.8
2.6
0
5
10
15
20
25
30
0
10
20
30
40
50
60
70
80
90
100 110 120
Forward Current IF [mA]
Forward Current IF [mA]
Ambient Temperature vs. Allowable Forward Current
35 30
Radiation Diagram
0 -30 30
Forward current IF (mA)
25 20 15 10
-60
60
5 0
-90
90
-25
0
25
50
75
100
Ambient temperature Ta(? )
Spectrum
1.0
55 50
Forward Current vs. Illumination
d=50 cm
0.8
45 40
Normalized Intensity
Illumination (lux)
0.6
35 30 25 20 15
0.4
d=100cm
0.2
10 5
0.0
400
500
600
700
0
0
50
100
150
200
250
300
350
400
450
Wavelength(nm)
Forward Current (mA)
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
6. Soldering Profile
The LED can be soldered in place using the reflow soldering method.
(1) Lead solder
Preliminary heating to be at maximum 210C for maximum 2 minutes. Soldering heat to be at maximum 240C for maximum 10 seconds.
280
Device Surface Temperature [ C]
240 200 160 120 80 40 0
o
0
15
30
45
60
75
90
105 120 135 150 165 180 195
(2) Lead-free solder
Soldering Times [sec]
Preliminary heating to be at maximum 220C for maximum 2 minutes. Soldering heat to be at maximum 260C for maximum 10 seconds.
280
Device Surface Temperature [ C]
240 200 160 120 80 40 0 0 15 30 45 60 75 90 105 120 135 150 165 180 195
o
Soldering Times [sec]
(3) Hand Soldering conditions
Not more than 5 seconds @MAX300C, under Soldering iron.
Note : In case that the soldered products are reused in soldering process, we don't guarantee the products
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
- 5/11
, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
7. Outline Dimensions And Materials
2.80 0
+0.1
+0.1
0.60.05
3.20 0
2.40
1.50
0.80.15
4
3
1.200.15
Anode 1
1
0.75
2
0.150.02
4 2 3 Cathode Cathode Cathode

Packing Mark Anode
( Tolerance: 0.2,
Unit: )
*MATERIALS
PARTS Package Encapsulationg Resin Electrodes
MATERIALS Heat-Resistant Polymer Mold Resin(with Phosphor) Ag Plating Copper Alloy
1.20
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
8.
Reel Dimensions
1.5
+0.1 -0
2.00.05 B
1.750.1
4.00.1
0.30.05
3.50.05
8.00.1
3.70.1
MA X.5
1.50.1
2.90.1
B'
MA X.5
1.70.1 B-B'
11.4 0.1 180 +0 -3 2.0 0.2
LABLE 13 0.2
9.0 0.3
30
10
22
(1) Quantity : 2000 pcs/Reel (2) Cumulative Tolerance: Cumulative Tolerance/10 pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1 - 0.7N when the cover tape is turned off from the carrier at 10 angle to be the carrier tape. (4) Package:P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
60
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
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Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
9. Reel Packing Structure
Reel
RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXX
KWT824
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR DESI PAK
Aluminum Vinyl Bag
RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXX
KWT824
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142
1 SIDE
RANK:
QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER :
XXX
TOP LED b a
c
1
KWT824
SEOUL SEMICONDUCTOR CO., LTD.
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
- 8/11
, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
10. Lot Number
The lot number is composed of the following characters; MWT - - Year ( 01 for 2001, 02 for 2002, 03 for 2003 ) - Month ( 01 for Jan., 02 for Feb.,11 for Nov., 12 for Dec.) - Day ( 01, 02, 03, 04, 28, 29, 30, 31.) - Rank ( A, B, C, D, W, X, Y, Z.)
RANK:
QUANTITY : XXXX
XXX
KWT824
LOT NUMBER : XXXXXXXXXX PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
- 9/11
, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
11. Precaution for use
(1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5~30 (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40 Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605. (4) In the case of that the components is humided, the components shall be dried; 24Hr at 805 or 12Hr at 1005. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (6) Quick cooling shall be avoided. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products. (9) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (10) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (11) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (12) The LEDs must be soldered within seven days after opening the moisture-proof packing. (13) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (14) The appearance and specifications of the product may be modified for improvement without notice. Humidity : maximum 65%HR
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
- 10/11
, . 205493/06.06.16 16:39/192.168.1.78
Copyright 2003 Seoul Semiconductor Co.,Ltd. All right reserved.
12. RELIABILITY
(1) TEST ITEMS AND RESULTS TEST ITEM Resistance to Soldering Heat*1 Solderability*1 Thermal Shock*1 High Temperature Storage*1 Humidity Heat Load*1 Steady State Life Test High Humidity Heat Life Test Low Temperature Life Test Pulse Life Test
*1
Test conditions Tsld = 260, 10 sec. Tsld = 2155, 5 sec. -30 (30 min) ~ 85(30 min) Transfer 5 min Ta = 100 Ta = 85, RH = 85% Ta = 25, IF = 20 mA/die Ta = 85, RH = 85%, IF = 10 mA/die Ta = -30, IF = 20 mA/die Ta = 60, RH = 90% On=2 sec,Off=2sec IF = 30 mA/die
Test Time 1 Time 1 Time 100 cycles 1000 hrs. 1000 hrs. 300 hrs 300 hrs 300 hrs
Number of Damaged 0 /22 0 /22 0 /22 0 /22 0 /22 0 /22 0 /22 0 /22
Judgment OK. OK. OK. OK. OK. OK. OK. OK.
100,000 cycle
0 /22
OK.
Faulty decision of this test item is made by On / Off after the test.
(2) CRITERIA FOR JUDGING THE DAMAGE Item Forward Voltage Reverse Current Luminous Intensity Symbol VF IR IV Test Condition IF = 20 mA/die VR = 5 V/die IF = 20 mA/die Criteria for Judgement Min. L.S.Lx1.2 L.S.Lx0.5 Max. U.S.Lx1.2 U.S.Lx2.0 -
U.S.L. : Upper Standard Level L.S.L. : Lower Standard Level
(3)ESD guarantee condition
Item HBM Test Condition 1000 V Criteria for Judgement IR =100 and below Test Form CONTACT
SSC-QP-0401-06(REV0.0)
SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-KWT824
- 11/11
, . 205493/06.06.16 16:39/192.168.1.78

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